Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele

Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele

4.11 - 1251 ratings - Source



Semiconductor wafer bonding continues to evolve as a crucial technology extending new integration schemes and disseminating new product architectures in such diverse areas as high quality silicon-on-insulator (SOI) materials for electronic applications, Si-Ge strained layers, Germanium-on-Insulator (GeOI), 3D device integration, Si on quartz or glass for thin film displays, compound semiconductor-on-Si heterostructures and Micro-Electro-Mechanical Systems.The cleaning was done using a SUSS MicroTec CL300 cleaner module (manual puddle dispense) on an XBC300 cluster platform while bonding was performed on a SUSS MicroTec CB200 Bonder. The wafer was puddled with the selectedanbsp;...


Title:Semiconductor Wafer Bonding 11: Science, Technology, and Applications - In Honor of Ulrich Gösele
Author: C. Colinge
Publisher:The Electrochemical Society - 2010-10-01
ISBN-13:

You must register with us as either a Registered User before you can Download this Book. You'll be greeted by a simple sign-up page.

Once you have finished the sign-up process, you will be redirected to your download Book page.

How it works:
  • 1. Register a free 1 month Trial Account.
  • 2. Download as many books as you like (Personal use)
  • 3. Cancel the membership at any time if not satisfied.


Click button below to register and download Ebook
Privacy Policy | Contact | DMCA